Title :
800 MHz power amplifier using envelope following technique
Author :
Staudinger, J. ; Gilsdorf, B. ; Newman, D. ; Norris, G. ; Sadowniczak, G. ; Sherman, R. ; Quach, T. ; Wang, V.
Author_Institution :
Semicond. Products Sector, Motorola Inc., Tempe, AZ, USA
Abstract :
This work describes a 2-W peak-envelope linear power amplifier based upon the envelope following (EF) technique. Both drain voltages of a two stage monolithic GaAs IC power amplifier are modulated with respect to the input RF signal using a high efficiency class-S modulator. The class-S modulator is implemented as a silicon IC consisting of a high-speed comparator and driver circuitry to supply currents in excess of 1 A. The RF amplifier IC utilizes two GaAs HEMT devices designed for class A/B operation. An envelope-feedback loop provides equalization of time delay differences between the envelope and RF signal paths as well as amplitude linearization. The resulting transmitter has adequate bandwidth to amplify an IS-136 π/4 DQPSK signal with required spectral linearity achieving 49% total efficiency at 1-W average output power using a 3.5 volt supply. At 10 dB power back-off, the system efficiency remains above 30%. Targeting low cost portable wireless handsets, the complete amplifier is realized using two integrated circuits with minimal off chip components
Keywords :
HEMT integrated circuits; UHF power amplifiers; comparators (circuits); driver circuits; mobile radio; modulators; radio transmitters; 2 W; 3.5 V; 800 MHz; GaAs; GaAs IC; HEMT devices; IS-136 π/4 DQPSK signal; RF amplifier; RF signal paths; Si; Si IC; amplitude linearization; class A/B operation; driver circuit; envelope following technique; equalization; high efficiency class-S modulator; high-speed comparator; low cost portable wireless handsets; time delay differences; transmitter; two stage monolithic IC power amplifier; Driver circuits; Gallium arsenide; High power amplifiers; High speed integrated circuits; Monolithic integrated circuits; Power amplifiers; Radiofrequency amplifiers; Radiofrequency integrated circuits; Silicon; Voltage;
Conference_Titel :
Radio and Wireless Conference, 1999. RAWCON 99. 1999 IEEE
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-5454-0
DOI :
10.1109/RAWCON.1999.810990