• DocumentCode
    3393385
  • Title

    Analysis on the parameters of adhesively bonding patch repairing cracked sandwich face panel

  • Author

    Wang, Yuequan ; Tong, Mingbo ; Zhu, Shuhua

  • Author_Institution
    Key Lab. of Fundamental Sci. for Nat. Defense, Nanjing Univ. of Aeronaut. & Astronaut., Nanjing
  • fYear
    2008
  • fDate
    10-12 Oct. 2008
  • Firstpage
    1340
  • Lastpage
    1344
  • Abstract
    The parameters of adhesively bonding patch, which include patch materials, patch size, patch thickness, have been analyzed on the stress concentration factor and the stress intensity factor (SIF) thanks to the 3D finite element method (FEM) in the paper. The adhesive shear modulus and thickness are studied in this paper as well. The aluminum sandwich face panel is analyzed and the results show that the Boron/Epoxy composite patch reduces more stress concentration factor and SIF comparing with the other patches. The stress concentration factor reaches the minimum when the fiber orientates the tension direction. Meanwhile, the stress concentration in the patch and the adhesive reach the maximum. The stress concentration factor in the aluminum face sheet decreases with the increasing patch thickness. But the effect of the patch thickness weakens when the patch thickness is larger than the face panel. The impact of the adhesive thickness on the stress concentration of the face panel reduces with the increasing adhesive shear modulus. The stress concentration factor increases when the adhesive thickness increases. The results are useful to design the bonded composite patch repair.
  • Keywords
    adhesive bonding; aluminium; finite element analysis; sandwich structures; sheet materials; structural panels; adhesive bonding; adhesive shear modulus; aluminum face sheet; cracked sandwich face panel; finite element method; patch repairing; stress intensity factor; Aircraft; Aluminum; Bonding; Finite element methods; Laboratories; Laminates; Resists; Space technology; Stress; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System Simulation and Scientific Computing, 2008. ICSC 2008. Asia Simulation Conference - 7th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-1786-5
  • Electronic_ISBN
    978-1-4244-1787-2
  • Type

    conf

  • DOI
    10.1109/ASC-ICSC.2008.4675580
  • Filename
    4675580