Title :
Proceedings Fourth International Symposium on Quality Electronic Design
Abstract :
The following topics are dealt with: VLSI design, modeling, simulation; IC packages; interconnected systems; noise analysis; system on chip; submicron technology; high speed circuits; reliability; IC testing; leakage currents; testing measurements.
Keywords :
VLSI; integrated circuit design; integrated circuit interconnections; integrated circuit manufacture; integrated circuit metallisation; integrated circuit noise; integrated circuit packaging; leakage currents; microprocessor chips; semiconductor process modelling; system-on-chip; IC packages; IC testing; VLSI design; VLSI modeling; VLSI simulation; electronic design; high speed circuits; interconnected systems; leakage currents; noise analysis; reliability; submicron technology; system on chip; testing measurements; Integrated circuit design; Integrated circuit interconnections; Integrated circuit manufacture; Integrated circuit metallization; Integrated circuit noise; Integrated circuit packaging; Leakage currents; Microprocessors; Semiconductor process modeling; Very-large-scale integration;
Conference_Titel :
Quality Electronic Design, 2003. Proceedings. Fourth International Symposium on
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7695-1881-8
DOI :
10.1109/ISQED.2003.1194698
