Title :
IC & package co-design: challenge or dream?
Author :
Casale-Rossi, Marco
Keywords :
Bonding; Costs; Design automation; Electronic design automation and methodology; Electronics packaging; Integrated circuit manufacture; Integrated circuit packaging; Semiconductor device packaging; Substrates; Wire;
Conference_Titel :
Quality Electronic Design, 2003. Proceedings. Fourth International Symposium on
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7695-1881-8
DOI :
10.1109/ISQED.2003.1194739
