• DocumentCode
    3394287
  • Title

    IC & package co-design: challenge or dream?

  • Author

    Casale-Rossi, Marco

  • fYear
    2003
  • fDate
    24-26 March 2003
  • Firstpage
    247
  • Lastpage
    249
  • Keywords
    Bonding; Costs; Design automation; Electronic design automation and methodology; Electronics packaging; Integrated circuit manufacture; Integrated circuit packaging; Semiconductor device packaging; Substrates; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2003. Proceedings. Fourth International Symposium on
  • Conference_Location
    San Jose, CA, USA
  • Print_ISBN
    0-7695-1881-8
  • Type

    conf

  • DOI
    10.1109/ISQED.2003.1194739
  • Filename
    1194739
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3394287