DocumentCode
3394648
Title
Coupled simulation of circuit and piezoelectric laminates
Author
Xu, Cheng-Gang ; Fiez, Terri ; Mayaram, Kartikeya
Author_Institution
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
fYear
2003
fDate
24-26 March 2003
Firstpage
369
Lastpage
372
Abstract
In this paper, an algorithm for the coupled simulation of circuit and piezoelectric laminate devices is presented. A finite element solver for piezoelectric laminates is included in the SPICE framework as a capacitor. The charge of this capacitor is a function of both the terminal voltage and the mechanical strain in the piezoelectric material. The coupled simulator allows simulation of novel micro power generation circuits based on piezoelectric laminates.
Keywords
capacitors; circuit simulation; finite element analysis; laminates; piezoelectric devices; piezoelectric materials; SPICE framework; capacitor; circuit devices; coupled simulation; coupled simulator; finite element solver; mechanical strain; micro power generation circuits; piezoelectric laminate devices; piezoelectric material; terminal voltage; Capacitive sensors; Capacitors; Circuit simulation; Coupling circuits; Finite element methods; Laminates; Piezoelectric devices; Piezoelectric materials; SPICE; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2003. Proceedings. Fourth International Symposium on
Print_ISBN
0-7695-1881-8
Type
conf
DOI
10.1109/ISQED.2003.1194760
Filename
1194760
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