• DocumentCode
    3394725
  • Title

    On-chip interconnect inductance - friend or foe

  • Author

    Wong, S. Simon ; Yue, Patrick ; Chang, Richard ; Kim, So-Young ; Kleveland, Bendik ; O´Mahony, Frank

  • Author_Institution
    Center for Integrated Syst., Stanford Univ., CA, USA
  • fYear
    2003
  • fDate
    24-26 March 2003
  • Firstpage
    389
  • Lastpage
    394
  • Abstract
    Inductance associated with on-chip wires can no longer be ignored as chip operation frequencies increase into GHz regime. Because the magnetic field propagates a very long range, the extraction of wire inductance is not just dependent on the immediate neighboring environment. This paper discusses the various difficulties of extracting inductance of randomly placed wires in a typical chip environment. With dedicated return path, the wire inductance can be controlled and benefit the design of high-speed circuits. Specific examples are illustrated.
  • Keywords
    high-speed integrated circuits; inductance; integrated circuit interconnections; 10 GHz; 16 GHz; 23 GHz; CMOS distributed amplifier; CMOS distributed oscillator; chip environment; chip operation frequencies; high speed circuits; magnetic field; on chip interconnect inductance; on chip wires; standing wave clock; wire inductance; Capacitance; Circuit simulation; Data mining; Frequency; Inductance; Integrated circuit interconnections; Magnetic fields; System-on-a-chip; Testing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2003. Proceedings. Fourth International Symposium on
  • Print_ISBN
    0-7695-1881-8
  • Type

    conf

  • DOI
    10.1109/ISQED.2003.1194764
  • Filename
    1194764