DocumentCode
3394725
Title
On-chip interconnect inductance - friend or foe
Author
Wong, S. Simon ; Yue, Patrick ; Chang, Richard ; Kim, So-Young ; Kleveland, Bendik ; O´Mahony, Frank
Author_Institution
Center for Integrated Syst., Stanford Univ., CA, USA
fYear
2003
fDate
24-26 March 2003
Firstpage
389
Lastpage
394
Abstract
Inductance associated with on-chip wires can no longer be ignored as chip operation frequencies increase into GHz regime. Because the magnetic field propagates a very long range, the extraction of wire inductance is not just dependent on the immediate neighboring environment. This paper discusses the various difficulties of extracting inductance of randomly placed wires in a typical chip environment. With dedicated return path, the wire inductance can be controlled and benefit the design of high-speed circuits. Specific examples are illustrated.
Keywords
high-speed integrated circuits; inductance; integrated circuit interconnections; 10 GHz; 16 GHz; 23 GHz; CMOS distributed amplifier; CMOS distributed oscillator; chip environment; chip operation frequencies; high speed circuits; magnetic field; on chip interconnect inductance; on chip wires; standing wave clock; wire inductance; Capacitance; Circuit simulation; Data mining; Frequency; Inductance; Integrated circuit interconnections; Magnetic fields; System-on-a-chip; Testing; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2003. Proceedings. Fourth International Symposium on
Print_ISBN
0-7695-1881-8
Type
conf
DOI
10.1109/ISQED.2003.1194764
Filename
1194764
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