• DocumentCode
    3394820
  • Title

    The effect of SiO2/Al2O3 weight ratio on the morphological and properties of polyimide/SiO2-Al2O3 ternary hybrid films

  • Author

    Liu, Lizhu ; Weng, Ling ; Zhu, Xingsong ; Yang, Liqian ; Lei, Qingquan

  • Author_Institution
    Key Lab. of Eng. Dielectric & Its Applic., Harbin Univ. of Sci. & Technol., Harbin, China
  • fYear
    2009
  • fDate
    19-23 July 2009
  • Firstpage
    777
  • Lastpage
    780
  • Abstract
    Polyimide/silica-alumina (PI/SiO2-Al2O3) hybrid films were prepared via sol-gel process with tetraethoxysilane (TEOS) and aluminum isopropylate (AIP) as inorganic precursors. The presence of SiO2 and Al2O3 inorganic phases and its weight ratio showed a remarkable effect on the microstructure and properties of the polyimide based hybrid films. The chemical structure of hybrid films was analyzed by Fourier transform infrared (FTIR) and the results showed that the completely hydrolysis of inorganic precursors and the formation of three dimensional Si-O-Al network in the hybrid films. The morphology and its distribution of inorganic phases in hybrid films were studied by scanning electron microscopy (SEM). The thermal and mechanical properties of the hybrid films were measured and compared to the pure PI. Results indicated that the incorporation of inorganic enhanced the thermal stability and mechanical properties of the hybrid films. However, the UV-vis transmittance of hybrid films was reduced.
  • Keywords
    Fourier transform spectra; alumina; elongation; infrared spectra; organic-inorganic hybrid materials; polymer films; scanning electron microscopy; silicon compounds; tensile strength; thermal stability; Fourier transform infrared spectra; UV-vis transmittance; aluminum isopropylate; chemical structure; elongation; hydrolysis; inorganic phase distribution; microstructure; morphology; polyimide; scanning electron microscopy; silica-alumina; sol-gel process; tensile strength; ternary hybrid films; tetraethoxysilane; thermal stability; three dimensional network; weight ratio; Aluminum; Chemical analysis; Fourier transforms; Inorganic chemicals; Mechanical factors; Mechanical variables measurement; Microstructure; Morphology; Polyimides; Scanning electron microscopy; Polyimide hybrid film; mechanical properties; morphology; thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4244-4367-3
  • Electronic_ISBN
    978-1-4244-4368-0
  • Type

    conf

  • DOI
    10.1109/ICPADM.2009.5252154
  • Filename
    5252154