DocumentCode :
3394820
Title :
The effect of SiO2/Al2O3 weight ratio on the morphological and properties of polyimide/SiO2-Al2O3 ternary hybrid films
Author :
Liu, Lizhu ; Weng, Ling ; Zhu, Xingsong ; Yang, Liqian ; Lei, Qingquan
Author_Institution :
Key Lab. of Eng. Dielectric & Its Applic., Harbin Univ. of Sci. & Technol., Harbin, China
fYear :
2009
fDate :
19-23 July 2009
Firstpage :
777
Lastpage :
780
Abstract :
Polyimide/silica-alumina (PI/SiO2-Al2O3) hybrid films were prepared via sol-gel process with tetraethoxysilane (TEOS) and aluminum isopropylate (AIP) as inorganic precursors. The presence of SiO2 and Al2O3 inorganic phases and its weight ratio showed a remarkable effect on the microstructure and properties of the polyimide based hybrid films. The chemical structure of hybrid films was analyzed by Fourier transform infrared (FTIR) and the results showed that the completely hydrolysis of inorganic precursors and the formation of three dimensional Si-O-Al network in the hybrid films. The morphology and its distribution of inorganic phases in hybrid films were studied by scanning electron microscopy (SEM). The thermal and mechanical properties of the hybrid films were measured and compared to the pure PI. Results indicated that the incorporation of inorganic enhanced the thermal stability and mechanical properties of the hybrid films. However, the UV-vis transmittance of hybrid films was reduced.
Keywords :
Fourier transform spectra; alumina; elongation; infrared spectra; organic-inorganic hybrid materials; polymer films; scanning electron microscopy; silicon compounds; tensile strength; thermal stability; Fourier transform infrared spectra; UV-vis transmittance; aluminum isopropylate; chemical structure; elongation; hydrolysis; inorganic phase distribution; microstructure; morphology; polyimide; scanning electron microscopy; silica-alumina; sol-gel process; tensile strength; ternary hybrid films; tetraethoxysilane; thermal stability; three dimensional network; weight ratio; Aluminum; Chemical analysis; Fourier transforms; Inorganic chemicals; Mechanical factors; Mechanical variables measurement; Microstructure; Morphology; Polyimides; Scanning electron microscopy; Polyimide hybrid film; mechanical properties; morphology; thermal stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-4367-3
Electronic_ISBN :
978-1-4244-4368-0
Type :
conf
DOI :
10.1109/ICPADM.2009.5252154
Filename :
5252154
Link To Document :
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