• DocumentCode
    3394888
  • Title

    Study on structures and properties of carbon nanotubes/thermosets nanocomposites subjected to external electric field during cure stage

  • Author

    Duan, Jingkuan ; Kim, Chonung ; Jiang, Pingkai ; Liu, Fei ; Wang, Genlin ; Zhang, Jun ; Huang, Xingyi

  • Author_Institution
    Dept. of Polymer Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
  • fYear
    2009
  • fDate
    19-23 July 2009
  • Firstpage
    789
  • Lastpage
    792
  • Abstract
    MWCNTs were dispersed in IPNs based on acrylate and epoxy. The influences of external electric field on the MWCNTs dispersion had been evaluated by optical microscopy and SEM. The microscopy measurements showed that the distribution of the MWCNTs depended strongly on the properties of the applied electric field. Applying ac electric field to the liquid MWCNTs/thermosets nanocomposites during curing stage could redistribute the MWCNTs, arranges them in chain-like structures and orients fibrous inclusions parallel to the applied electric field. However, dc electric field could not do so. We also presented the relationships between the microstructures and various physical properties of nanocomposites. The resulting nanocomposites displayed the interesting dielectric properties, which were significantly dependence on their special microstructures of inclusions and host matrix.
  • Keywords
    carbon nanotubes; curing; dielectric materials; disperse systems; electric fields; nanocomposites; SEM; acrylate; chain like structure; curing stage; dielectric property; epoxy; external electric field; fibrous inclusion; host matrix; multiwalled carbon nanotube; optical microscopy; thermosets nanocomposite; Carbon nanotubes; Curing; Electric fields; Frequency; Magnetic field measurement; Microstructure; Nanocomposites; Optical microscopy; Scanning electron microscopy; Surface cracks; alignment; electric field; multiwalled carbon nanotubes; nanocomposite;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4244-4367-3
  • Electronic_ISBN
    978-1-4244-4368-0
  • Type

    conf

  • DOI
    10.1109/ICPADM.2009.5252163
  • Filename
    5252163