DocumentCode :
3394943
Title :
Study on charge transport mechanism in polyimide films
Author :
Zhou, Liren ; Wu, Guangning ; Kaijiang Cao ; Luo, Yang
Author_Institution :
Sch. of Electr. Eng., Southwest Jiaotong Univ., Chengdu, China
fYear :
2009
fDate :
19-23 July 2009
Firstpage :
800
Lastpage :
803
Abstract :
As a core component of ac drive electric locomotive, performance of inverter-fed motor directly influences the stability and reliability of locomotive running. However, insulation early failures occur frequently. Presently, polyimide film, as a special type of engineering plastic film, widely applied in turn to turn insulation and turn to ground insulation of inverter-fed motors is a kind of basic insulating material. This paper investigates charge transport mechanism in polyimide films based on measuring and comparing space charge accumulation threshold field between corona-resistant and common polyimide films. The results reveal that space charge accumulation threshold field of corona-resistant polyimide film is higher than that of common polyimide film; the adding of nano-particles effectively increases dielectric properties of corona-resistant film.
Keywords :
AC motor drives; charge exchange; dielectric properties; electric locomotives; organic insulating materials; polymer films; space charge; ac drive electric locomotive; charge transport mechanism; common polyimide film; corona-resistant polyimide film; dielectric property; engineering plastic film; insulating material; inverter-fed motor; locomotive reliability; locomotive stability; nanoparticle; space charge accumulation threshold field; turn to ground insulation; turn to turn insulation; AC motors; Charge measurement; Current measurement; Dielectric measurements; Plastic films; Plastic insulation; Polyimides; Reliability engineering; Space charge; Stability; Inverter-fed motor; charge transport; polyimide; threshold field;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-4367-3
Electronic_ISBN :
978-1-4244-4368-0
Type :
conf
DOI :
10.1109/ICPADM.2009.5252172
Filename :
5252172
Link To Document :
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