DocumentCode :
3395101
Title :
Effect of electrode materials on breakdown of Al2O3/PI films
Author :
Song, Yilei ; Yin, Jinghua ; Bu, Wenbin ; Liu, Xiaoxu
Author_Institution :
Key Lab. of Eng. Dielectric & Its Applic., Harbin Univ. of Sci. & Technol., Harbin, China
fYear :
2009
fDate :
19-23 July 2009
Firstpage :
823
Lastpage :
825
Abstract :
Nanohybrid polymers have many excellent properties, such as high dielectric constant, high dielectric strength and low loss and so on, which apply in the electricity and electron fields widely. In this paper, the nanohybrid Al2O3/PI films were prepared by Sol-Gel process, then, Au and Al were sputtered on the films surface respectively as electrode. The dielectric properties (dielectric constant, loss tangent and dielectric breakdown strength) of the samples were measured and the surface morphologies of the breakdown holes were observed by SEM. The experimental results show that the electrode materials effect on the dielectric properties and breakdown characteristics of nanohybrid PI films. The dielectric properties of the films deposited by Au are better than that of Al, and the size of breakdown hole is smaller.
Keywords :
aluminium compounds; dielectric properties; electric breakdown; electrodes; nanostructured materials; polymer films; sol-gel processing; sputtering; surface morphology; SEM; breakdown hole size; dielectric property; electrode material; film breakdown characteristics; nanohybrid film; nanohybrid polymer; sol-gel process; surface morphology; Dielectric breakdown; Dielectric constant; Dielectric loss measurement; Dielectric losses; Dielectric materials; Electric breakdown; Electrodes; Gold; Polymers; Surface morphology; Al2O3/PI film; breakdown characteristics; electrodes material;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-4367-3
Electronic_ISBN :
978-1-4244-4368-0
Type :
conf
DOI :
10.1109/ICPADM.2009.5252190
Filename :
5252190
Link To Document :
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