Design and characterization of a post-processed copper heat sink for smart power drivers [lateral nDMOS drivers]

Author

Van den Bosch, G. ; Webers, T. ; Driessens, E. ; Elattari, B. ; Wojciechowski, D. ; Gassot, P. ; Moens, P. ; Groeseneken, G.

Author_Institution

IMEC, Leuven, Belgium

fYear

2005

fDate

4-7 April 2005

Firstpage

27

Lastpage

31

Abstract

Heat sinks of various geometries have been post-processed by copper electroplating on top of large area power drivers to improve thermal management. The efficiency of the heat sink was quantified by energy capability (EC) measurements. Thermal as well as electro-thermal simulations backed up experimental results. A 25 μm thick copper layer improved EC by approx. 25%, translating into a driver area reduction by the same amount for EC critical applications.

Keywords

copper; electroplated coatings; heat sinks; power MOSFET; power integrated circuits; semiconductor device models; thermal management (packaging); 25 micron; Cu; driver area reduction; electro-thermal simulation; electroplating; energy capability measurements; heat sink efficiency; integrated MOSFET switches; large area power drivers; lateral nDMOS drivers; post-processed heat sink; smart power drivers; thermal management; Ambient intelligence; Copper; Geometry; Heat sinks; Joining processes; National electric code; Passivation; Switches; Temperature; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronic Test Structures, 2005. ICMTS 2005. Proceedings of the 2005 International Conference on

Print_ISBN

0-7803-8855-0

Type

conf

DOI

10.1109/ICMTS.2005.1452210

Filename

1452210