DocumentCode :
3395352
Title :
Nanoclay-filled epoxy composites for electrical insulation applications
Author :
Morales, A. Guevara ; Taylor, A.C. ; Fu, M. ; Hyde, A. ; Perrot, F.
Author_Institution :
Dept. of Mech. Eng., Imperial Coll. London, London, UK
fYear :
2009
fDate :
19-23 July 2009
Firstpage :
868
Lastpage :
871
Abstract :
Bulk samples of epoxy were modified with organically-modified nanoclays. The morphology of the modified materials has been characterised using microscopy and X-ray diffraction techniques, and found to be intercalated. Improvements in tensile and fracture properties were found. The toughening mechanisms were crack deflection and plastic deformation of the epoxy. The permittivity and loss angle of the nanocomposites decreased and their breakdown strength was increased as desired for insulation applications. The electrical damage zone was analysed with different microscopy techniques.
Keywords :
X-ray diffraction; clay; cracks; electric breakdown; epoxy insulation; fracture; microscopy; nanostructured materials; permittivity; plastic deformation; X-ray diffraction techniques; breakdown strength; crack deflection; electrical damage zone; electrical insulation; fracture properties; materials morphology; microscopy; nanoclay-filled epoxy composites; nanocomposites; organically-modified nanoclays; plastic deformation; tensile properties; toughening mechanisms; Dielectrics and electrical insulation; Electric breakdown; Glass; Mechanical factors; Nanocomposites; Nanoparticles; Permittivity; Power transformer insulation; Testing; X-ray diffraction; Epoxy; breakdown; microstructure; nanoclay; nanocomposite; permittivity; toughness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-4367-3
Electronic_ISBN :
978-1-4244-4368-0
Type :
conf
DOI :
10.1109/ICPADM.2009.5252226
Filename :
5252226
Link To Document :
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