Nanoclay-filled epoxy composites for electrical insulation applications

Author

Morales, A. Guevara ; Taylor, A.C. ; Fu, M. ; Hyde, A. ; Perrot, F.

Author_Institution

Dept. of Mech. Eng., Imperial Coll. London, London, UK

fYear

2009

fDate

19-23 July 2009

Firstpage

868

Lastpage

871

Abstract

Bulk samples of epoxy were modified with organically-modified nanoclays. The morphology of the modified materials has been characterised using microscopy and X-ray diffraction techniques, and found to be intercalated. Improvements in tensile and fracture properties were found. The toughening mechanisms were crack deflection and plastic deformation of the epoxy. The permittivity and loss angle of the nanocomposites decreased and their breakdown strength was increased as desired for insulation applications. The electrical damage zone was analysed with different microscopy techniques.

Keywords

X-ray diffraction; clay; cracks; electric breakdown; epoxy insulation; fracture; microscopy; nanostructured materials; permittivity; plastic deformation; X-ray diffraction techniques; breakdown strength; crack deflection; electrical damage zone; electrical insulation; fracture properties; materials morphology; microscopy; nanoclay-filled epoxy composites; nanocomposites; organically-modified nanoclays; plastic deformation; tensile properties; toughening mechanisms; Dielectrics and electrical insulation; Electric breakdown; Glass; Mechanical factors; Nanocomposites; Nanoparticles; Permittivity; Power transformer insulation; Testing; X-ray diffraction; Epoxy; breakdown; microstructure; nanoclay; nanocomposite; permittivity; toughness;

fLanguage

English

Publisher

ieee

Conference_Titel

Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the

Conference_Location

Harbin

Print_ISBN

978-1-4244-4367-3

Electronic_ISBN

978-1-4244-4368-0

Type

conf

DOI

10.1109/ICPADM.2009.5252226

Filename

5252226