Title :
The design of a 3D surface geometry acquisition system for highly irregular shaped objects: with application to CZ semiconductor manufacture
Author :
Sujan, Vivek A. ; Dubowsky, Steven
Author_Institution :
Dept. of Mech. Eng., MIT, Cambridge, MA, USA
Abstract :
A robotic system is being developed to automate the crucible packing process in CZ semiconductor wafer production. It requires the delicate manipulation and packing of highly irregular polycrystalline silicon nuggets, into a fragile fused silica crucible. For this application, a dual optical 3D surface geometry measuring system that uses active laser triangulation has been developed and successfully tested. One part of the system measures the geometry profile of a nugget being packed and the other the profile of the nuggets already in the crucible. A resolution of 1 mm with 15 KHz sampling frequency is achieved. Data from the system is used by a packing algorithm to determine optimal nugget placement. The system is shown to achieve high production rates, required precision and cost effectiveness
Keywords :
computer vision; geometry; industrial manipulators; integrated circuit manufacture; laser ranging; materials handling; process control; 15 kHz; 3D surface geometry acquisition system; CZ semiconductor manufacture; CZ semiconductor wafer production; Si; active laser triangulation; crucible packing process; dual optical 3D surface geometry measuring system; geometry profile; highly irregular polycrystalline silicon nuggets; highly irregular shaped objects; Computational geometry; Frequency; Geometrical optics; Production systems; Robotics and automation; Sampling methods; Semiconductor lasers; Silicon compounds; Surface emitting lasers; System testing;
Conference_Titel :
Robotics and Automation, 1999. Proceedings. 1999 IEEE International Conference on
Conference_Location :
Detroit, MI
Print_ISBN :
0-7803-5180-0
DOI :
10.1109/ROBOT.1999.772429
