Title :
Verification and co-design of the package and die power delivery system using wavelets
Author :
Ferzli, Imad A. ; Chiprout, Eli ; Najm, Farid N.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Toronto, Toronto, ON
Abstract :
We introduce a wavelet-based framework to characterize circuit currents and compute worst-case supply/ground voltage fluctuations. This framework is apt at determining the impact of the various stages of the power delivery network, enabling their co-design.
Keywords :
electronics packaging; wavelet transforms; circuit currents; die power delivery system; package co-design; wavelet-based framework; worst-case supply-ground voltage fluctuations; Computational modeling; Electromagnetic modeling; Fluctuations; Frequency domain analysis; Packaging; Power system modeling; RLC circuits; Time frequency analysis; Voltage; Wavelet analysis;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
DOI :
10.1109/EPEP.2008.4675862
