• DocumentCode
    3395444
  • Title

    Verification and co-design of the package and die power delivery system using wavelets

  • Author

    Ferzli, Imad A. ; Chiprout, Eli ; Najm, Farid N.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Toronto, Toronto, ON
  • fYear
    2008
  • fDate
    27-29 Oct. 2008
  • Firstpage
    7
  • Lastpage
    10
  • Abstract
    We introduce a wavelet-based framework to characterize circuit currents and compute worst-case supply/ground voltage fluctuations. This framework is apt at determining the impact of the various stages of the power delivery network, enabling their co-design.
  • Keywords
    electronics packaging; wavelet transforms; circuit currents; die power delivery system; package co-design; wavelet-based framework; worst-case supply-ground voltage fluctuations; Computational modeling; Electromagnetic modeling; Fluctuations; Frequency domain analysis; Packaging; Power system modeling; RLC circuits; Time frequency analysis; Voltage; Wavelet analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2873-1
  • Type

    conf

  • DOI
    10.1109/EPEP.2008.4675862
  • Filename
    4675862
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3395444