Intelligent built-in test and stress management

The authors describe two areas of technology, time stress measurement devices (TSMDs) and smart built-in test (smart BIT), which offer a combined approach to meeting future BIT needs. With reference to TSMD, one or more microelectronic packages are being developed with the capability of providing programmable and environmental stress measurement and recording. Smart BIT is an enhancement to traditional functional BIT which utilizes artificial intelligence techniques to produce an integrated test methodology for increased BIT effectiveness and confidence levels. The implementation of these techniques in conjunction with comprehensive fault-logging of the BIT output, associated TSMD, data and smart BIT decision criteria provides a singular, integrated, and complete test and maintenance capability in support of the needs of two-level maintenance. The state of this research and development is described along with the effect of its implementation on the respective operational and maintenance communities