DocumentCode :
3396042
Title :
Analysis of EBG structures using SPICE models of multiple planes
Author :
Kobayashi, Naoki ; Morishita, Ken ; Harada, Takashi
Author_Institution :
NEC Syst. Jisso Res. Labs., Sagamihara
fYear :
2008
fDate :
27-29 Oct. 2008
Firstpage :
111
Lastpage :
114
Abstract :
Compared to measurements, SPICE models of multiple planes are demonstrated to be effective for analyzing electromagnetic band gap (EBG) structures where unit cells are parallel waveguides coupled to stacked cavities through via posts.
Keywords :
SPICE; photonic band gap; voids (solid); waveguides; SPICE models; electromagnetic band gap structures; multiple planes; parallel waveguides; stacked cavities; Coupled mode analysis; Electromagnetic analysis; Electromagnetic measurements; Electromagnetic modeling; Electromagnetic waveguides; Metamaterials; Periodic structures; Planar waveguides; SPICE; Waveguide discontinuities;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
Type :
conf
DOI :
10.1109/EPEP.2008.4675890
Filename :
4675890
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3396042
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