DocumentCode :
3396200
Title :
Characterization of halogen-free package materials using cavity resonators
Author :
Aygun, Kemal ; Hu, Grace
Author_Institution :
Assembly & Test Technol. Dev., Intel Corp., Chandler, AZ
fYear :
2008
fDate :
27-29 Oct. 2008
Firstpage :
147
Lastpage :
150
Abstract :
Dielectric properties of substrate materials have a significant impact on electrical performance of packages including signaling power loss, propagation delay and crosstalk. With the focus on halogen-free (HF) package substrates, it is critical to understand the impact of this material change on high-speed signal integrity. In this paper, a closed rectangular cavity resonator and an open Fabry-Perot cavity resonator are proposed to characterize package materials over 2 GHz - 28 GHz range. The paper first studies the metrology repeatability and sensitivity to sample positioning and sample thickness. Then the proposed metrologies are used for electrical characterization of both HF and halogenated (H) package core materials. Finally, the impact of the core material change on the high-speed signaling performance is investigated through a modeling study for a typical differential input/output (IO) interface.
Keywords :
cavity resonators; dielectric properties; electronics packaging; Fabry-Perot cavity resonator; cavity resonators; closed rectangular cavity resonator; crosstalk; dielectric properties; frequency 2 GHz to 28 GHz; halogen-free package materials; high-speed signal integrity; input-output interface; metrology repeatability; power loss signaling; propagation delay; sample positioning sensitivity; substrate materials; Cavity resonators; Dielectric losses; Dielectric materials; Dielectric substrates; Hafnium; Metrology; Packaging; Performance loss; Propagation delay; Propagation losses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
Type :
conf
DOI :
10.1109/EPEP.2008.4675899
Filename :
4675899
Link To Document :
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