Development of a cost-reduced package thru DOE validation and zero-margin design concept

As gold price hits record high after record high since the turn of millennium and fast approaching the USD1,000 per ounce barrier, the cost of wirebond package has rocketed high because Gold (99.9%) is the major material for wire bonding. Instead of turning existing chip into using flip chip packaging technology, various cost reduction steps, including package form-factor and wire reduction, are gaining higher priority. Electrical concerns, reliability and product compatibility remain the major key technical challenges. This paper details the engineering hurdles with the new package designed that comes with huge crucial package parameters reduction, and its resolutions thru design of experiment (DOE) experiments and debugging simulation analysis.