DocumentCode
3396283
Title
Intermittent faults and effects on reliability of integrated circuits
Author
Constantinescu, Cristian
Author_Institution
Adv. Micro Devices, Fort Collins, CO
fYear
2008
fDate
28-31 Jan. 2008
Firstpage
370
Lastpage
374
Abstract
A significant amount of research has been aimed at analyzing the effects of high energy particles on semiconductor devices. However, less attention has been given to the intermittent faults. Field collected data and failure analysis results presented in this paper clearly show intermittent faults are a major source of errors in modern integrated circuits. The root cause for these faults ranges from manufacturing residuals to oxide breakdown. Burstiness and high error rates are specific manifestations of the intermittent faults. They may be activated and deactivated by voltage, frequency, and operating temperature variations. The aggressive scaling of semiconductor devices and the higher circuit complexity are expected to increase the likelihood of occurrence of the intermittent faults, despite the extensive use of fault avoidance techniques. Herein we discuss the effectiveness of several fault tolerant approaches, taking into consideration the specifics of the errors generated by intermittent faults. Several solutions, previously proposed for handling particle induced soft errors, are exclusively based on software and too slow for handling large bursts of errors. As a result, hardware implemented fault tolerant techniques, such as error detecting and correcting codes, self checking, and hardware implemented instruction retry, are necessary for mitigating the impact of the intermittent faults, both in the case of microprocessors, and other complex integrated circuits.
Keywords
fault diagnosis; integrated circuit reliability; semiconductor device breakdown; semiconductor device manufacture; failure analysis; fault avoidance techniques; integrated circuits reliability; intermittent faults; manufacturing residuals; semiconductor devices; Circuit faults; Electric breakdown; Error analysis; Failure analysis; Fault tolerance; Hardware; Integrated circuit reliability; Semiconductor device manufacture; Semiconductor devices; Voltage; intermittent faults; oxide breakdown; process variations; timing violations;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability and Maintainability Symposium, 2008. RAMS 2008. Annual
Conference_Location
Las Vegas, NV
ISSN
0149-144X
Print_ISBN
978-1-4244-1460-4
Electronic_ISBN
0149-144X
Type
conf
DOI
10.1109/RAMS.2008.4925824
Filename
4925824
Link To Document