• DocumentCode
    3396283
  • Title

    Intermittent faults and effects on reliability of integrated circuits

  • Author

    Constantinescu, Cristian

  • Author_Institution
    Adv. Micro Devices, Fort Collins, CO
  • fYear
    2008
  • fDate
    28-31 Jan. 2008
  • Firstpage
    370
  • Lastpage
    374
  • Abstract
    A significant amount of research has been aimed at analyzing the effects of high energy particles on semiconductor devices. However, less attention has been given to the intermittent faults. Field collected data and failure analysis results presented in this paper clearly show intermittent faults are a major source of errors in modern integrated circuits. The root cause for these faults ranges from manufacturing residuals to oxide breakdown. Burstiness and high error rates are specific manifestations of the intermittent faults. They may be activated and deactivated by voltage, frequency, and operating temperature variations. The aggressive scaling of semiconductor devices and the higher circuit complexity are expected to increase the likelihood of occurrence of the intermittent faults, despite the extensive use of fault avoidance techniques. Herein we discuss the effectiveness of several fault tolerant approaches, taking into consideration the specifics of the errors generated by intermittent faults. Several solutions, previously proposed for handling particle induced soft errors, are exclusively based on software and too slow for handling large bursts of errors. As a result, hardware implemented fault tolerant techniques, such as error detecting and correcting codes, self checking, and hardware implemented instruction retry, are necessary for mitigating the impact of the intermittent faults, both in the case of microprocessors, and other complex integrated circuits.
  • Keywords
    fault diagnosis; integrated circuit reliability; semiconductor device breakdown; semiconductor device manufacture; failure analysis; fault avoidance techniques; integrated circuits reliability; intermittent faults; manufacturing residuals; semiconductor devices; Circuit faults; Electric breakdown; Error analysis; Failure analysis; Fault tolerance; Hardware; Integrated circuit reliability; Semiconductor device manufacture; Semiconductor devices; Voltage; intermittent faults; oxide breakdown; process variations; timing violations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability and Maintainability Symposium, 2008. RAMS 2008. Annual
  • Conference_Location
    Las Vegas, NV
  • ISSN
    0149-144X
  • Print_ISBN
    978-1-4244-1460-4
  • Electronic_ISBN
    0149-144X
  • Type

    conf

  • DOI
    10.1109/RAMS.2008.4925824
  • Filename
    4925824