Title :
How to develop a qualification test plan for RoHS products
Author :
Silverman, Mike ; Schenkelberg, Fred ; Hillman, Craig
Author_Institution :
Ops A La Carte, LLC, Saratoga, CA
Abstract :
The subject matter we consider in this paper are the significant reliability uncertainties around lead-free solder and how to best consider these risks and mitigate them so as not to take a hit in the area of reliability during the lead-free transition. Like the rest of the electronics industry, your products will transition to restriction of hazardous substances (RoHS) compliance. This includes the transition to lead-free solder, and at this time, there are significant reliability uncertainties around lead-free solder. Even if your product does not need to be compliant, the materials and processes that make up your product are changing. During this time of rapid transition, there is a significant new body of knowledge to understand to determine the areas of greatest risk to the reliability of your product. In this paper, we will highlight a few of these significant risk areas and how to best mitigate these risks during the transition.
Keywords :
RoHS compliance; electronics industry; quality control; reliability; risk analysis; solders; RoHS products; electronics industry; lead-free solder; qualification test plan; reliability uncertainties; restriction-of-hazardous-substances; risks mitigation; Delamination; Environmentally friendly manufacturing techniques; Failure analysis; Lead; Materials reliability; Moisture; Qualifications; Soldering; Testing; Tin; RoHS; delamination; qualification; underplate;
Conference_Titel :
Reliability and Maintainability Symposium, 2008. RAMS 2008. Annual
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4244-1460-4
Electronic_ISBN :
0149-144X
DOI :
10.1109/RAMS.2008.4925825