Title :
2008 IEEE electrical performance of electronic packaging suppression of vertical coupling using Electromagnetic Band Gap structures
Author :
Sankaran, Nithya ; Huh, Suzanne ; Swaminathan, Madhavan ; Tummala, Rao
Author_Institution :
Packaging Res. Centre, Georgia Inst. of Technol., Atlanta, GA
Abstract :
This paper for the first time demonstrates the use of electromagnetic band gap (EBG) structures for isolation between multiple plane pairs along the vertical direction. Planar EBG structures have been applied for the suppression of vertical noise coupling in the GHz range of frequencies. Simulation and measurement results showing good isolation in the stop bands of the EBGs are presented.
Keywords :
electronics packaging; photonic band gap; IEEE electrical performance; electromagnetic band gap structures; electronic packaging suppression; vertical noise coupling; Apertures; Capacitors; Dielectric substrates; Electromagnetic coupling; Electromagnetic measurements; Electronics packaging; Frequency; Metamaterials; Nonhomogeneous media; Periodic structures;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
DOI :
10.1109/EPEP.2008.4675906
