DocumentCode :
3396343
Title :
Including the impact of connecting vias in the performance metric evaluation for board-level optimization of decoupling capacitors
Author :
Mondal, Mosin ; Connor, Samuel ; Archambeault, Bruce ; Jandhyala, Vikram
Author_Institution :
Dept. of Electr. Eng., Univ. of Washington, Seattle, WA
fYear :
2008
fDate :
27-29 Oct. 2008
Firstpage :
177
Lastpage :
180
Abstract :
Existing decoupling capacitor optimization techniques tend to neglect the impact of via parasitics while evaluating the performance metrics. This work demonstrates that ignoring the impact of connecting vias can produce optimistic results leading to functional failure. An efficient method for including via-parasitics in the performance metric evaluation is presented for more accurate design optimization.
Keywords :
capacitors; network synthesis; simulated annealing; board-level optimization; decoupling capacitor optimization techniques; design optimization; performance metric evaluation; simulated annealing; Design optimization; Frequency; Impedance; Joining processes; Measurement; Optimization methods; Paramagnetic resonance; Power capacitors; Simulated annealing; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
Type :
conf
DOI :
10.1109/EPEP.2008.4675907
Filename :
4675907
Link To Document :
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