Title :
Sensitivity computation of interconnect capacitances with respect to geometric parameters
Author :
Bi, Yu ; van der Kolk, K. ; Ioan, D. ; Van Der Meijs, N.P.
Author_Institution :
EEMCS, Delft Univ. of Technol., Delft
Abstract :
This paper presents an algorithm that enables an extension of standard 3d capacitance extraction to take into account the effects of small dimensional variations of interconnects by calculating the corresponding capacitance sensitivities. By using an adjoint technique, capacitances and their sensitivities w.r.t. multiple geometric parameters can be obtained with one-time 3d extraction using the boundary element method (BEM).
Keywords :
boundary-elements methods; capacitance; feature extraction; integrated circuit interconnections; IC interconnects; boundary element method; capacitance sensitivities; geometric parameters; interconnect capacitance; one-time 3d extraction; sensitivity computation; Bismuth; Boundary element methods; Capacitance; Circuit optimization; Conductors; Integrated circuit interconnections; SPICE; Signal analysis; Solid modeling; Symmetric matrices;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
DOI :
10.1109/EPEP.2008.4675916
