Title :
Fast iterative solution algorithms for the frequency-domain layered finite-element based analysis of large-scale on-chip interconnect structures
Author :
Sheng, Feng ; Jiao, Dan
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
Abstract :
An effective preconditioner P is proposed in this work for solving the surface-unknown-based reduced system matrix in the frequency-domain layered finite element method. This preconditioner is effective because it can converge the iterative solution of the reduced system matrix in a few iterations. It is computationally efficient because P-1b with b being an arbitrary vector can be obtained in linear complexity in both CPU time and memory consumption. With this preconditioner, the reduced system matrix in the layered finite element method is solved efficiently. The algorithms are rigorous without making any approximation. They apply to any arbitrarily-shaped multilayer structure. Numerical and experimental results demonstrated the accuracy, effectiveness, and efficiency of the proposed fast solution algorithms in analyzing large-scale on-chip interconnects.
Keywords :
finite element analysis; integrated circuit interconnections; iterative methods; large scale integration; matrix algebra; arbitrarily-shaped multilayer structure; fast iterative solution algorithms; frequency-domain layered finite-element based analysis; large-scale on-chip interconnect structures; linear complexity; memory consumption; surface-unknown-based reduced system matrix; Algorithm design and analysis; Capacitance; Dielectric substrates; Finite element methods; Frequency domain analysis; Integrated circuit interconnections; Iterative algorithms; Large-scale systems; Nonhomogeneous media; Transmission line matrix methods; On-chip; electromagnetic modeling; finite-element method; frequency domain; iterative solution; preconditioner;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
DOI :
10.1109/EPEP.2008.4675922