• DocumentCode
    3396595
  • Title

    New Developments in Shielding Materials

  • Author

    Fenical, Gary

  • Author_Institution
    Laird Technol., Chesterfield
  • fYear
    2006
  • fDate
    5-5 May 2006
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Advances in electronic equipment are occurring at a rapid pace. The wireless revolution, increasing power levels in computers and servers, higher frequency systems, decreasing size of cell phones, to name a few. To keep pace with the EMI shielding needs of these devices a wide range of new and improved products have been developed over the past few years and many more are on the drawing boards. Just about every class of shielding product has seen noteworthy changes. The uses, properties, and advantages of these new materials and advanced EMI shielding product designs was described, including: ldrhigh performance, dent resistant vent panels ldrhigh aspect ratio form in place (FiP) ldr ultra soft sculpted fabric over foam (FOF) ldr conductive foam (CF) ldr metal-mold in place (MIP) combination gaskets.
  • Keywords
    electromagnetic shielding; fabrics; foams; gaskets; metals; vents (mechanical components); EMI shielding product designs; combination gaskets; conductive foam; dent resistant vent panels; electronic equipment; fabric over foam; metal-mold in place; ratio form in place; Cellular phones; Conducting materials; Electromagnetic interference; Electronic equipment; Fabrics; Frequency; Gaskets; Inorganic materials; Product design; Vents;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Systems, Applications and Technology Conference, 2006. LISAT 2006. IEEE Long Island
  • Conference_Location
    Long Island, NY
  • Print_ISBN
    978-1-4244-0300-4
  • Electronic_ISBN
    978-1-4244-0300-4
  • Type

    conf

  • DOI
    10.1109/LISAT.2006.4302649
  • Filename
    4302649