DocumentCode
3396595
Title
New Developments in Shielding Materials
Author
Fenical, Gary
Author_Institution
Laird Technol., Chesterfield
fYear
2006
fDate
5-5 May 2006
Firstpage
1
Lastpage
5
Abstract
Advances in electronic equipment are occurring at a rapid pace. The wireless revolution, increasing power levels in computers and servers, higher frequency systems, decreasing size of cell phones, to name a few. To keep pace with the EMI shielding needs of these devices a wide range of new and improved products have been developed over the past few years and many more are on the drawing boards. Just about every class of shielding product has seen noteworthy changes. The uses, properties, and advantages of these new materials and advanced EMI shielding product designs was described, including: ldrhigh performance, dent resistant vent panels ldrhigh aspect ratio form in place (FiP) ldr ultra soft sculpted fabric over foam (FOF) ldr conductive foam (CF) ldr metal-mold in place (MIP) combination gaskets.
Keywords
electromagnetic shielding; fabrics; foams; gaskets; metals; vents (mechanical components); EMI shielding product designs; combination gaskets; conductive foam; dent resistant vent panels; electronic equipment; fabric over foam; metal-mold in place; ratio form in place; Cellular phones; Conducting materials; Electromagnetic interference; Electronic equipment; Fabrics; Frequency; Gaskets; Inorganic materials; Product design; Vents;
fLanguage
English
Publisher
ieee
Conference_Titel
Systems, Applications and Technology Conference, 2006. LISAT 2006. IEEE Long Island
Conference_Location
Long Island, NY
Print_ISBN
978-1-4244-0300-4
Electronic_ISBN
978-1-4244-0300-4
Type
conf
DOI
10.1109/LISAT.2006.4302649
Filename
4302649
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