DocumentCode :
3396596
Title :
Eliminating via-plane coupling using ground vias for high-speed signal transitions
Author :
Songping Wu ; Xin Chang ; Schuster, Christian ; Gu, Xiaoxiong ; Jun Fan
Author_Institution :
UMR/MST EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO
fYear :
2008
fDate :
27-29 Oct. 2008
Firstpage :
247
Lastpage :
250
Abstract :
When a high-speed signal transits through a via that penetrates a plane pair, parallel-plane resonances can cause additional insertion loss for the signal. To eliminate this via-plane coupling, ground vias are added adjacent to the signal via. This paper discusses the impact of the ground vias as a function of the number of the ground vias, their locations, and the size of the plane pair. A block-by-block physics-based equivalent circuit modeling approach is used in the study. The underlying physics of the phenomenon and the design implications are also discussed in the paper.
Keywords :
equivalent circuits; integrated circuit modelling; printed circuit design; equivalent circuit modeling; ground vias; high-speed signal transitions; insertion loss; parallel-plane resonance; plane pair; printed circuit boards; via-plane coupling; Design engineering; Equivalent circuits; Geometry; High speed integrated circuits; Insertion loss; Integrated circuit modeling; Nonhomogeneous media; Packaging; Physics; Solid modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
Type :
conf
DOI :
10.1109/EPEP.2008.4675926
Filename :
4675926
Link To Document :
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