Title :
Transient simulation of lossy interconnects using the Latency Insertion Method (LIM)
Author :
Klokotov, Dmitri ; Schutt-Ainé, José
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL
Abstract :
In this work an extension of the Latency Insertion Method (LIM) formulation to the treatment of networks with frequency-dependent parameters is discussed. It is shown that the algorithm can be transformed to allow efficient simulation of both skin effect of conductors as well as frequency dependent substrate loss in high speed circuit interconnects.
Keywords :
circuit simulation; conductors (electric); integrated circuit interconnections; skin effect; conductors; frequency dependent substrate loss; high speed circuit interconnects; latency insertion method; skin effect; Circuit analysis; Circuit simulation; Computational modeling; Delay; Equations; Finite difference methods; Frequency dependence; Integrated circuit interconnections; Time domain analysis; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
DOI :
10.1109/EPEP.2008.4675927
