Title :
Effects of partially broken HF signal return on different packaging levels
Author :
Winkel, T.-M. ; Frech, R. ; Gneiting, Thomas
Author_Institution :
IBM Deutschland Res. & Developmen GmbH, Boblingen
Abstract :
Electro magnetic field effects for broken high frequency (HF) signal returns are analysed for discontinuities in different packaging levels. Board connectors with a huge signal count and high speed signals as well as typical multi chip module structures are analysed using 3D field calculations. Resulting coupling effects were calculated and also verified with time domain measurements. The results are discussed with respect to the impact on signal integrity.
Keywords :
electric connectors; electronics packaging; 3D field calculations; board connectors; broken high frequency signal returns; electro magnetic field effects; multichip module structures; packaging levels; signal integrity; Connectors; Couplings; Frequency; Hafnium; Magnetic analysis; Magnetic field measurement; Packaging; Signal analysis; Voltage; Wires;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
DOI :
10.1109/EPEP.2008.4675928
