DocumentCode
3396723
Title
Design and study of piezoresistive polycrystalline silicon sensor
Author
Li, Ye ; Zhang, Ping
Author_Institution
Zhenjiang High Vocational Technol. Sch., Zhenjiang, China
Volume
3
fYear
2010
fDate
9-10 Oct. 2010
Firstpage
202
Lastpage
205
Abstract
Piezoresistive polycrystalline silicon sensor has the advantages of high sensitivity and nice stability as well as not hard to manufacture, so it is suitable for measuring the ultra-micro pressure. The mature polycrystalline silicon is adopted as sensitive material for the sensor in this paper. Two island-beam structure is used as the chip; stress dissipative structure has been designed; the mask structure is discussed in detail. The sensor can match the need of ultra-micro pressure measurement and overload protection. A detailed study of the structure is developed by the applications of finite element analyses (FEA) software. The study offers important reference to the optimization of the sensor chip. Finally, the paper studies the static and dynamic performance of the sensor. We find that the structure we designed here has good linearity, high overload protection and good sensitivity. It is suitable for measuring 500Pa micro pressure.
Keywords
finite element analysis; pressure measurement; pressure sensors; stress measurement; finite element analyses software; mask structure; overload protection; piezoresistive polycrystalline silicon sensor; pressure measurement; stress dissipative structure; ultra micro pressure; FEM; micro pressure sensor; polycrystalline silicon; strain diaphragm; stress dissipative structure;
fLanguage
English
Publisher
ieee
Conference_Titel
Future Information Technology and Management Engineering (FITME), 2010 International Conference on
Conference_Location
Changzhou
Print_ISBN
978-1-4244-9087-5
Type
conf
DOI
10.1109/FITME.2010.5655430
Filename
5655430
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