DocumentCode :
3396756
Title :
An H2-matrix-based integral-equation solver of linear-complexity for large-scale full-wave modeling of 3D circuits
Author :
Chai, Wenwen ; Jiao, Dan
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
fYear :
2008
fDate :
27-29 Oct. 2008
Firstpage :
283
Lastpage :
286
Abstract :
State-of-the-art integral-equation based computational electromagnetic methods rely on techniques that can perform a matrix-vector multiplication in O(N log N) operations, with N being the matrix size. In this work, a fast integral-equation-based solver was developed for full-wave modeling of large-scale complicated 3D circuits. Both memory consumption and time complexity were shown to be O(N). The superior performance applies to any arbitrarily shaped 3D structure. Numerical results demonstrate its accuracy and efficiency.
Keywords :
computational complexity; computational electromagnetics; integral equations; integrated circuit modelling; matrix algebra; network analysis; 3D circuits; H2-matrix-based integral-equation solver; computational electromagnetic methods; large-scale full-wave modeling; linear-complexity; matrix-vector multiplication; memory consumption; state-of-the-art integral-equation; time complexity; Central Processing Unit; Computational electromagnetics; Electrodynamics; Electromagnetic modeling; Hydrogen; Integral equations; Integrated circuit modeling; Integrated circuit packaging; Kernel; Large-scale systems; H2 matrix; Integral-equation methods; full-wave modeling; integrated circuits; package;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
Type :
conf
DOI :
10.1109/EPEP.2008.4675935
Filename :
4675935
Link To Document :
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