• DocumentCode
    3396906
  • Title

    Minimizing crosstalk noise in vias or pins by optimizing signal assignment in a high-speed differential bus

  • Author

    Zhou, Yaping ; Mandrekar, Rohan ; Zhou, Tingdong ; Chun, Sungjun ; Harvey, Paul ; Weekly, Roger

  • Author_Institution
    Syst. & Technol. Group, IBM, Austin, TX
  • fYear
    2008
  • fDate
    27-29 Oct. 2008
  • Firstpage
    313
  • Lastpage
    316
  • Abstract
    Vias in packages and boards, land-grid-array pins, and connector pins introduce significant crosstalk in high-speed differential buses. There are many possible differential signal assignments in those areas that have very different electrical performance. This paper proposes and demonstrates an efficient method to find a large number of possible assignments and assess them to obtain an optimal assignment with the best performance.
  • Keywords
    crosstalk; field buses; interference suppression; connector pins; crosstalk noise minimization; high-speed differential bus; land-grid-array pins; signal assignment optimisation; vias; Acoustic noise; Connectors; Crosstalk; Electronics packaging; Inductance; Mutual coupling; Optimization methods; Pins; Scattering parameters; Signal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2873-1
  • Type

    conf

  • DOI
    10.1109/EPEP.2008.4675943
  • Filename
    4675943