Title :
Multi-layer fringe-field augmentations for the efficient modeling of package power planes
Author :
Bharathy, Krishna ; Sankaran, Nithya ; Engin, A. Ege ; Swaminathan, Madhavan
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
Abstract :
Modern mixed signal system-on-package integration schemes employ power distribution networks with highly irregular geometries. To model this problem, most techniques resort to approximations which lead to the fringe fields being ignored. In this paper, an efficient modeling method is proposed for multi-layered package power/ground planes with apertures. The solution technique employs the multi-layer finite difference method (M-FDM), with fringe field corrections provided by a 2D electrostatic solver. This scheme allows for efficient frequency domain simulation, and the S-parameters obtained from the method have been compared with full-wave simulations and measurements.
Keywords :
S-parameters; distribution networks; finite difference methods; integrated circuit modelling; mixed analogue-digital integrated circuits; system-on-package; 2D electrostatic solver; S-parameters; frequency domain simulation; mixed signal system-on-package integration; multilayer finite difference method; multilayer fringe-field augmentations; package power planes; power distribution networks; Apertures; Electrostatic measurements; Finite difference methods; Frequency domain analysis; Frequency measurement; Geometry; Packaging; Power system modeling; Power systems; Scattering parameters;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
DOI :
10.1109/EPEP.2008.4675948
