DocumentCode
3396970
Title
Multi-layer fringe-field augmentations for the efficient modeling of package power planes
Author
Bharathy, Krishna ; Sankaran, Nithya ; Engin, A. Ege ; Swaminathan, Madhavan
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
fYear
2008
fDate
27-29 Oct. 2008
Firstpage
331
Lastpage
334
Abstract
Modern mixed signal system-on-package integration schemes employ power distribution networks with highly irregular geometries. To model this problem, most techniques resort to approximations which lead to the fringe fields being ignored. In this paper, an efficient modeling method is proposed for multi-layered package power/ground planes with apertures. The solution technique employs the multi-layer finite difference method (M-FDM), with fringe field corrections provided by a 2D electrostatic solver. This scheme allows for efficient frequency domain simulation, and the S-parameters obtained from the method have been compared with full-wave simulations and measurements.
Keywords
S-parameters; distribution networks; finite difference methods; integrated circuit modelling; mixed analogue-digital integrated circuits; system-on-package; 2D electrostatic solver; S-parameters; frequency domain simulation; mixed signal system-on-package integration; multilayer finite difference method; multilayer fringe-field augmentations; package power planes; power distribution networks; Apertures; Electrostatic measurements; Finite difference methods; Frequency domain analysis; Frequency measurement; Geometry; Packaging; Power system modeling; Power systems; Scattering parameters;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2873-1
Type
conf
DOI
10.1109/EPEP.2008.4675948
Filename
4675948
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