• DocumentCode
    3397013
  • Title

    Generation Expansion Planning based on multi-area reliability exponential analytic model and emission control

  • Author

    Sun, Rong-fu ; Chen, Lin ; Song, Yong-hua ; Sun, Yuan-Zhang

  • Author_Institution
    Dept. of Electr. Eng., Tsinghua Univ., Beijing
  • fYear
    2008
  • fDate
    21-24 April 2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Generation Expansion Planning (GEP) includes requirements of power demands, installation capacities, loss of load probability (LOLP) levels, locations, and environmental limitations for emission controls. A combined model is described in this paper. Firstly, an exponential analytic model is put forward based on reliability interaction between interconnected areas, this model illustrates the influences of installed capacity of each area and transfer capability of the flowgate lines on the generation system reliability of every single area; Secondly, investment cost, operating and maintenance cost are included in the objective function, while flowgate transmission limitations and emission control are used as constraints in optimization. Two models were built to show the importance of coordination between GEP and transmission upgrade. Test results on five-bus system are presented and discussed.
  • Keywords
    air pollution control; power distribution; power factor; power generation planning; probability; emission control; generation expansion planning; loss of load probability; multi-area reliability exponential analytic model; multi-area system; power transfer distribution factor; reliability interaction; Capacity planning; Constraint optimization; Cost function; Investments; Maintenance; Power demand; Power generation; Power system interconnection; Power system modeling; Power system reliability; Emission control; Exponential analytic model; Flowgate; Multi-area system; Power transfer distribution factor (PTDF);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transmission and Distribution Conference and Exposition, 2008. T&D. IEEE/PES
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    978-1-4244-1903-6
  • Electronic_ISBN
    978-1-4244-1904-3
  • Type

    conf

  • DOI
    10.1109/TDC.2008.4517104
  • Filename
    4517104