Title :
Packaging modeling using fast broadband surface integral equation method
Author :
Qian, Zhi Guo ; Chew, Weng Cho
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL
Abstract :
The augmented electric field integral equation with frequency scaling provides a stable formulation over broad frequency band. With the iterative solver and the mixed-form fast multipole algorithm, large scale packaging problems can be solved efficiently.
Keywords :
electronics packaging; iterative methods; iterative solver; large scale packaging problems; mixed-form fast multipole algorithm; packaging modeling; surface integral equation method; Acceleration; Electric breakdown; Frequency; Integral equations; Iterative algorithms; Iterative methods; Large-scale systems; Matrix decomposition; Packaging; Physics;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
DOI :
10.1109/EPEP.2008.4675952
