Title :
Mesoscopic FEM simulation of dielectric properties of composite material and experimental verification
Author :
Li, Z.H. ; Huang, Z.P. ; Samee, A. ; Zheng, X.L. ; Li, C.
Author_Institution :
Key Lab. of Eng. Dielectrics, Harbin Univ. Sci. Tech., Harbin, China
Abstract :
Composite material technology has a great potential for development of new insulating materials. By use of computer simulation method to study the dielectric properties of composite material can save a lot of time and material resources. In this paper we have studied the dielectric properties of electric field grading non-linear composites through computer simulation and verified them with experimental studies. For inorganic filler, a mesoscopic scale computer simulation method which uses finite element technique is used to study dielectric properties After transient FEM simulation under AC voltage, Least-squares method is adopted to decompose the total current into resistive current and capacitive current according to applied macro-field strength. The simulation results are in agreement with experimental results.
Keywords :
dielectric polarisation; dielectric properties; electrical conductivity; filled polymers; finite element analysis; insulating materials; least squares approximations; permittivity; applied macro-field strength; capacitive current; dielectric properties; electric field grading; equivalent conductivity; finite element technique; inorganic filler; insulating materials; least-squares method; low frequency polarization; mesoscopic FEM simulation; mesoscopic scale computer simulation; nonlinear composites; permittivity; polarization; resistive current; transient FEM simulation; Analytical models; Composite materials; Computational modeling; Computer simulation; Conductivity; Dielectric materials; Dielectrics and electrical insulation; Finite element methods; Microscopy; Voltage; Composite material; FEM; dielectric properties; mesoscopic; nonlinear;
Conference_Titel :
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-4367-3
Electronic_ISBN :
978-1-4244-4368-0
DOI :
10.1109/ICPADM.2009.5252313