• DocumentCode
    3397183
  • Title

    Power quality enhancement by TCSC application to mitigate the impact of transformer inrush current

  • Author

    Khederzadeh, Mojtaba

  • Author_Institution
    Dept. of Electr. Eng., Power & Water Univ. of Technol., Tehran
  • fYear
    2008
  • fDate
    21-24 April 2008
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Excessive transient inrush current occurs during transformers energization, especially when the transformer core has remnant flux that adds to the flux build-up after switching. System voltage sag due to inrush current affects the power quality of the network in proximity of the transformer. The extent to which power quality is degraded depends on short circuit MVA at the source bus, and the magnitude and decay time constant of the transient current. This paper investigates the application of Thyristor Controlled Series Capacitor (TCSC) at the line ends to mitigate the impact of transformer inrush current on power quality. First, it describes the influence of TCSC on the short circuit MVA at the source bus, and then the mechanism by which the TCSC is able to mitigate voltage sags. It also investigates and illustrates different TCSC´s modes of operation on transformer inrush current. The ability of TCSC to limit fault currents by developing high inductive impedance under fault conditions with respect to transformer inrush current is also investigated.
  • Keywords
    power supply quality; power transformers; thyristor applications; fault currents; power quality enhancement; system voltage sag; thyristor controlled series capacitor; transformer core; transformer inrush current; transformers energization; Circuits; Degradation; Fault currents; Impedance; Power capacitors; Power quality; Surges; Thyristors; Transformer cores; Voltage fluctuations; Inrush current; Power Quality; Thyristor Controlled Series Capacitor (TCSC); Transformer; Voltage Sag;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transmission and Distribution Conference and Exposition, 2008. T&D. IEEE/PES
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    978-1-4244-1903-6
  • Electronic_ISBN
    978-1-4244-1904-3
  • Type

    conf

  • DOI
    10.1109/TDC.2008.4517114
  • Filename
    4517114