DocumentCode
3397230
Title
Role of nano-filler on partial discharge resistance and dielectric breakdown strength of micro-Al2 O3 / epoxy composites
Author
li, Zhe ; Okamoto, Kenji ; Ohki, Yoshimichi ; Tanaka, Toshikatsu
Author_Institution
Grad. Sch. of Inf., Production & Syst., Waseda Univ., Kitakyushu, Japan
fYear
2009
fDate
19-23 July 2009
Firstpage
753
Lastpage
756
Abstract
Epoxy resin often suffers lower dielectric breakdown strength if micro-fillers are loaded. It might be possible to raise the once lowered breakdown strength, if nano-fillers are added. In this paper, such performances were investigated on model specimens consisting of alumina (Al2O3). First of all, PD (partial discharge) behavior on the surfaces of samples was clarified in the insulation system consisting of a flat copper electrode attached on an epoxy substrate. Then, on the basis of finding, the breakdown strengths were investigated by using a sphere to sphere electrode structure with a flat sample inserted. Several materials consist of neat epoxy, 5 %wt nano-Al2O3/ epoxy composite, 60 %wt micro-Al2O3/ epoxy composite and 2 %wt nano- 60 % wt micro-Al2O3/ epoxy composite. It was found that nano-micro- Al2O3/ epoxy composite is higher in both dielectric strength and PD resistance than micro-Al2O3/ epoxy composite.
Keywords
aluminium compounds; electric breakdown; epoxy insulation; filled polymers; nanocomposites; partial discharges; Al2O3; alumina-epoxy composites; dielectric breakdown strength; epoxy substrate; flat copper electrode; insulation system; nanofiller; partial discharge behavior; partial discharge resistance; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Electric breakdown; Epoxy resins; Immune system; Partial discharges; Surface discharges; Thermal conductivity; Thermal resistance; breakdown strength; epoxy; nano-Al2 O3 ; nano-micro-composite; partial discharge;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location
Harbin
Print_ISBN
978-1-4244-4367-3
Electronic_ISBN
978-1-4244-4368-0
Type
conf
DOI
10.1109/ICPADM.2009.5252321
Filename
5252321
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