• DocumentCode
    3397253
  • Title

    Effect of nanofiller at low frequency behavior of dielectric insulator

  • Author

    Veena, M.G. ; Renukappa, N.M. ; Seetharamu, S. ; Sampathkumaran, P.

  • Author_Institution
    Dept. of Electron. & Commun., Sri Jayachamarajendra Coll. of Eng., Mysore, India
  • fYear
    2009
  • fDate
    19-23 July 2009
  • Firstpage
    745
  • Lastpage
    748
  • Abstract
    In electrical and communication systems, thermosets are considered one of the most important classes of dielectric materials. The addition of nanofiller to such materials enhances the electrical properties. Nano-filler additions to thermoset polymers restrict the chain movement in the frequency range of 10-1 to 102 Hz. The measurement in such cases is done using low frequency dielectric spectroscopy. This paper presents the low frequency behavior of nanosized alumina filled epoxy composites in terms of capacitance and tan delta measurements. The results indicate that the tan delta, real and imaginary capacitance values decrease with increase in the frequency. A theoretical model for capacitance has been developed for comparison. It is found that a good correlation exists in respect of capacitance value measured with that of the theoretical ones.
  • Keywords
    dielectric materials; insulating materials; communication systems; dielectric insulator; dielectric materials; dielectric spectroscopy; electrical systems; low frequency behavior; nanofiller; Capacitance measurement; Curing; Dielectric materials; Dielectric measurements; Dielectrics and electrical insulation; Educational institutions; Electrochemical impedance spectroscopy; Frequency measurement; Nanostructured materials; Polymers; Dielectric Spectroscopy; Nanoalumina; real and imaginary dielectric constant ɛ; tan δ;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4244-4367-3
  • Electronic_ISBN
    978-1-4244-4368-0
  • Type

    conf

  • DOI
    10.1109/ICPADM.2009.5252323
  • Filename
    5252323