DocumentCode
3397527
Title
Lessons learnt from lead-free soldering implementation - real example
Author
Cheng, W.M. ; Wu, H.Y.
Author_Institution
Astec Agency Ltd., Kowloon, China
fYear
2005
fDate
15-18 March 2005
Firstpage
42
Lastpage
50
Abstract
This paper presents the practical requirements of implementing the lead-free soldering process, which include the material requirement with the summary of supplier positions and directions, design concern, process setup, qualification procedure and the common defects handling, also the way to handle tin whisker even without the industrial standard at the moment. The key issue is that lead-free wave soldering is no longer a mystery, what you need is to start up with the right approach with correct machine and material selection, then fine tune the process which is similar to the tin-lead process. Most important thing is always keeping an eye on the process deviation.
Keywords
design for environment; lead; printed circuit manufacture; wave soldering; defects handling; industrial standard; lead-free soldering; process deviation; process setup; qualification procedure; supplier positions; tin whisker; wave soldering; Aerospace electronics; Aerospace industry; Communication industry; Costs; Electronics industry; Environmentally friendly manufacturing techniques; Lead; Soldering; Switches; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Asian Green Electronics, 2005. AGEC. Proceedings of 2005 International Conference on
Print_ISBN
0-7803-8806-2
Type
conf
DOI
10.1109/AGEC.2005.1452314
Filename
1452314
Link To Document