• DocumentCode
    3397527
  • Title

    Lessons learnt from lead-free soldering implementation - real example

  • Author

    Cheng, W.M. ; Wu, H.Y.

  • Author_Institution
    Astec Agency Ltd., Kowloon, China
  • fYear
    2005
  • fDate
    15-18 March 2005
  • Firstpage
    42
  • Lastpage
    50
  • Abstract
    This paper presents the practical requirements of implementing the lead-free soldering process, which include the material requirement with the summary of supplier positions and directions, design concern, process setup, qualification procedure and the common defects handling, also the way to handle tin whisker even without the industrial standard at the moment. The key issue is that lead-free wave soldering is no longer a mystery, what you need is to start up with the right approach with correct machine and material selection, then fine tune the process which is similar to the tin-lead process. Most important thing is always keeping an eye on the process deviation.
  • Keywords
    design for environment; lead; printed circuit manufacture; wave soldering; defects handling; industrial standard; lead-free soldering; process deviation; process setup; qualification procedure; supplier positions; tin whisker; wave soldering; Aerospace electronics; Aerospace industry; Communication industry; Costs; Electronics industry; Environmentally friendly manufacturing techniques; Lead; Soldering; Switches; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Asian Green Electronics, 2005. AGEC. Proceedings of 2005 International Conference on
  • Print_ISBN
    0-7803-8806-2
  • Type

    conf

  • DOI
    10.1109/AGEC.2005.1452314
  • Filename
    1452314