DocumentCode :
3397609
Title :
Simulation of dynamic temperature distribution of high power microwave devices and new flip-chip design
Author :
Galdetskiy, A.V. ; Vorobiyov, A.A. ; Shiriaeva, E.V.
Author_Institution :
FSUE "Istok", Fryazino
fYear :
2008
fDate :
8-12 Sept. 2008
Firstpage :
81
Lastpage :
82
Abstract :
Analytical and numerical results for dynamic temperature distribution in the semiconductor die operating in pulse mode are presented. A new type of flip-chip design is considered.
Keywords :
flip-chip devices; microwave devices; power electronics; temperature distribution; dynamic temperature distribution; flip-chip design; high power microwave devices; pulse mode; semiconductor die; Analytical models; Gallium nitride; Microwave devices; Temperature dependence; Temperature distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave & Telecommunication Technology, 2008. CriMiCo 2008. 2008 18th International Crimean Conference
Conference_Location :
Sevastopol, Crimea
Print_ISBN :
978-966-335-166-7
Electronic_ISBN :
978-966-335-169-8
Type :
conf
DOI :
10.1109/CRMICO.2008.4676300
Filename :
4676300
Link To Document :
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