• DocumentCode
    3397609
  • Title

    Simulation of dynamic temperature distribution of high power microwave devices and new flip-chip design

  • Author

    Galdetskiy, A.V. ; Vorobiyov, A.A. ; Shiriaeva, E.V.

  • Author_Institution
    FSUE "Istok", Fryazino
  • fYear
    2008
  • fDate
    8-12 Sept. 2008
  • Firstpage
    81
  • Lastpage
    82
  • Abstract
    Analytical and numerical results for dynamic temperature distribution in the semiconductor die operating in pulse mode are presented. A new type of flip-chip design is considered.
  • Keywords
    flip-chip devices; microwave devices; power electronics; temperature distribution; dynamic temperature distribution; flip-chip design; high power microwave devices; pulse mode; semiconductor die; Analytical models; Gallium nitride; Microwave devices; Temperature dependence; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave & Telecommunication Technology, 2008. CriMiCo 2008. 2008 18th International Crimean Conference
  • Conference_Location
    Sevastopol, Crimea
  • Print_ISBN
    978-966-335-166-7
  • Electronic_ISBN
    978-966-335-169-8
  • Type

    conf

  • DOI
    10.1109/CRMICO.2008.4676300
  • Filename
    4676300
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3397609