DocumentCode
3397686
Title
Dielectric breakdown of gamma-ray irradiated epoxy resin in crossed field
Author
Du, B.X. ; Liu, H.J. ; Wang, K.F. ; Zhen, Yin
Author_Institution
Sch. of Electr. Eng. & Autom., Tianjin Univ., Tianjin, China
fYear
2009
fDate
19-23 July 2009
Firstpage
647
Lastpage
650
Abstract
This paper describes the effects of magnetic field and low pressure on dielectric breakdown of gamma-ray irradiated epoxy resin. The experiment was carried out by applying a dc pulse voltage with the intervals adjusted from 5 ms to 10 ms. The samples were irradiated in air up to 100 kGy and then up to 1000 kGy with a dose rate of 10 kGy/h by using a 60Co gamma-source. The magnetic flux density of the magnetic filed was 495 mT and the pressure was reduced to 1 kPa. The effects of the pressure, magnetic filed and gamma-ray irradiation on the time to dielectric breakdown and discharge quantity were studied. Obtained results revealed that the time to dielectric breakdown increased with increasing the total dose of radiation and was delayed by decreasing the pressure and increasing the magnetic field. The discharge quantity decreased with increasing the total dose of gamma-ray irradiation and increasing the magnetic field, but increased with decreasing the pressure.
Keywords
electric breakdown; epoxy insulation; gamma-ray effects; magnetic field effects; Co; crossed field; dielectric breakdown; gamma ray irradiated epoxy resin; low pressure; magnetic field effect; magnetic flux density; magnetic flux density 495 mT; pressure 1 kPa; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Electrodes; Epoxy resins; Magnetic fields; Magnetic flux; Magnetic materials; Polymers; Superconducting magnets; dielectric breakdown; gamma-ray irradiation; low pressure; magnetic field;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location
Harbin
Print_ISBN
978-1-4244-4367-3
Electronic_ISBN
978-1-4244-4368-0
Type
conf
DOI
10.1109/ICPADM.2009.5252346
Filename
5252346
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