Title :
Mechanical design and optimization of flip chip bonder
Author :
Chen, Zhou ; Yuehong, Yin ; Xinming, Guo ; Zhongqin, Lin ; Han, Ding
Author_Institution :
Adv. Microelectron. Manuf. Center, Shanghai Jiao Tong Univ., China
Abstract :
A general process based on computer aided static analysis for flip chip bonder mechanical design and optimization is presented. The design of a gantry-form FC bonder structure is introduced in detail. The results of the deformation simulation and static analysis proved that the mechanical structure of FC bonder. fulfilled the pre-determined requirements.
Keywords :
CAD; bonding processes; computer aided analysis; electronics packaging; flip-chip devices; mechanical engineering computing; optimisation; production equipment; bonding processes; computer aided static analysis; deformation simulation; flip chip bonder design; gantry-form bonder structure; mechanical design; optimization; Assembly; Bonding forces; Ceramics; Conductive adhesives; Deformable models; Design optimization; Flip chip; Space heating; Temperature; Virtual manufacturing;
Conference_Titel :
Asian Green Electronics, 2005. AGEC. Proceedings of 2005 International Conference on
Print_ISBN :
0-7803-8806-2
DOI :
10.1109/AGEC.2005.1452325
