• DocumentCode
    3397887
  • Title

    Future systems-on-a-chip: impact on engineering education

  • Author

    De Man, H.

  • Author_Institution
    IMEC, Katholieke Univ., Leuven, Belgium
  • fYear
    1998
  • fDate
    4-7 Jan 1998
  • Firstpage
    572
  • Lastpage
    577
  • Abstract
    Deep-Submicron (DS) technology is rapidly leading to systems-on-a-chip (SoC) designed at the processor-memory level, and containing a lot of mixed-signal and even RF architectures. However, exploitation of DS technology will depend critically on the availability of global system engineers able to bridge the gap between software-centric system thinking and hardware-software implementation, in novel silicon architectures. This requires a rethinking of present engineering schools which are not well equipped to tackle global system engineering aspects. The concept of design institute is introduced where, based on visionary system design demonstrators, new methodologies, tools, libraries and courses are created and distributed over the global network. Design institutes provide a learning school for new design paradigms and form the ideal environment for the education of global system designers and system design minded faculty
  • Keywords
    VLSI; circuit CAD; computer aided instruction; design engineering; electronic engineering education; integrated circuit design; deep submicron technology; design institute concept; design methodologies; engineering education; global network; global system engineering aspects; processor-memory level; system design demonstrators; systems-on-a-chip; Bridges; Design methodology; Educational institutions; Educational products; Engineering education; Process design; Radio frequency; Silicon; System-on-a-chip; Systems engineering and theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, 1998. Proceedings., 1998 Eleventh International Conference on
  • Conference_Location
    Chennai
  • ISSN
    1063-9667
  • Print_ISBN
    0-8186-8224-8
  • Type

    conf

  • DOI
    10.1109/ICVD.1998.646666
  • Filename
    646666