• DocumentCode
    3398057
  • Title

    Thin wire formulation for 3-D modeling of a ground wire

  • Author

    Ahmad, W. F Wan ; Thomas, D.W.P. ; Christopoulos, C.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Univ. Putra Malaysia, Serdang, Malaysia
  • fYear
    2008
  • fDate
    21-24 April 2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This work is aimed at developing electromagnetic modeling techniques to enable researchers to predict the behaviors of substation grounding system to lightning strikes. Transient responses of a grounding system at a substation of a power plant have been investigated using three 3-D transmission- line models. 3-D TLM algorithm has been used and a better performance of a thin wire model for ground conductors in homogeneous lossy medium was developed for 3-D modeling of a grounding system. A coaxial system has been employed as a simple well behaved structure with parameters which can be found analytically of the transmission-line model in order to develop this thin wire model for the 3-D formulation. It is validated by comparing its characteristic impedance with an air- filled square coaxial transmission line model where the results are in a good agreement.
  • Keywords
    earthing; substation protection; transmission line theory; 3D transmission-line models; electromagnetic modeling techniques; ground conductors; ground wire; lightning strikes; substation grounding system; thin wire formulation; Coaxial components; Electromagnetic modeling; Electromagnetic transients; Grounding; Lightning; Power system modeling; Power system transients; Substations; Three dimensional displays; Wire; Finite Difference Time Domain (FDTD); Transmission-Line Modeling (TLM); derivative Gaussian wave; earth grounding conductors; homogeneous soil medium; lightning protection system (LPS); lightning stroke; square coaxial transmission line model; thin wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transmission and Distribution Conference and Exposition, 2008. T&D. IEEE/PES
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    978-1-4244-1903-6
  • Electronic_ISBN
    978-1-4244-1904-3
  • Type

    conf

  • DOI
    10.1109/TDC.2008.4517167
  • Filename
    4517167