• DocumentCode
    3398897
  • Title

    α-β phase transition of quartz based on molecular dynamics simulations

  • Author

    Cheng, Yonghong ; Luo, Naidong ; Xie, Xiaojun ; Li, Mang ; Jiang, Lili ; Yu, Sujiao

  • Author_Institution
    State Key Lab. of Electr. Insulation & Power Equip., Xi´´an Jiaotong Univ., Xi´´an, China
  • fYear
    2009
  • fDate
    19-23 July 2009
  • Firstpage
    378
  • Lastpage
    381
  • Abstract
    alpha-beta phase transition of quartz has a strong impact on its dielectric properties. This paper introduces molecular dynamics to simulate the phase transition of alpha-beta quartz. Firstly, build the alpha-quartz model, and then simulate the dynamical property in ensemble NPT at different temperatures. With varied temperatures, the values of structure properties like bond length and bond angle were changed. The changes are distinct near the alpha-beta phase transition temperature. At the same time, the other parameters like density and so on were also changed in the process. By analyzing the changes of these parameters, we can obtain the temperature of phase transition. This simulation temperature is consistent with the experiment data. Findings in this paper may present useful information for processing of the SiO2 phase transition.
  • Keywords
    bond lengths; molecular dynamics method; quartz; solid-state phase transformations; SiO2; alpha-beta phase transition temperature; bond length; dielectric properties; molecular dynamics simulations; Bonding; Chemical industry; Computational modeling; Dielectric materials; Dielectrics and electrical insulation; Elasticity; Industrial electronics; Microscopy; Silicon; Temperature; α-β phase transition; molecular dynamics; quartz;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4244-4367-3
  • Electronic_ISBN
    978-1-4244-4368-0
  • Type

    conf

  • DOI
    10.1109/ICPADM.2009.5252408
  • Filename
    5252408