DocumentCode
3399348
Title
Non-slicing floorplans with boundary constraints using generalized Polish expression
Author
Chen, De-Sheng ; Lin, Chang-Tzu ; Wang, Yi-Wen
Author_Institution
Dept. of Inf. Eng. & Comput. Sci., Feng Chia Univ., Taichung, Taiwan
fYear
2003
fDate
21-24 Jan. 2003
Firstpage
342
Lastpage
345
Abstract
In this paper, we address the problem of VLSI floorplanning, considering boundary constraints. The problem is practical and crucial in physical design, since architects decide to arrange some I/O involved modules along the chip boundary to minimize both chip area and off-chip connections. By using a new representation called the generalized Polish expression, we propose an efficient algorithm to handle the boundary constraints on non-slicing floorplans. In addition, a new fixing heuristic, based on modular similarity, is also presented to effectively fix the generated infeasible floorplans during the process. The experimental results are good in commonly used MCNC benchmark circuits.
Keywords
VLSI; circuit optimisation; constraint handling; heuristic programming; integrated circuit layout; integrated circuit packaging; minimisation; modules; I/O involved modules; VLSI floorplanning; boundary constraints; chip area minimization; chip boundary; chip edge I/O; fixing heuristic; generalized Polish expression; infeasible floorplan fixing; modular similarity; nonslicing floorplans; off-chip connection minimization; Benchmark testing; Circuits; Computer science;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2003. Proceedings of the ASP-DAC 2003. Asia and South Pacific
Print_ISBN
0-7803-7659-5
Type
conf
DOI
10.1109/ASPDAC.2003.1195039
Filename
1195039
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