Title :
VPS and reliability of solder joint
Author :
Pietrikova, Alena ; Durisin, J.
Author_Institution :
Dept. of Technol. in Electron., Tech. Univ. of Kosice, Kosice, Slovakia
Abstract :
This paper deals with presentation of some new aspects of solder ternary alloy 96.5Sn3Ag0.5Cu (wt.%) - SAC305, in order to determine variations in mechanical properties and microstructure caused by treatment in vapour phase soldering (VPS) as well as by accelerated isothermal aging. These specimens have been melted and solidified on HASL (hot air solder levelling) and Ni/Au (ENIG) PCB (printed circuit board) substrate in order to prevent compositional changes due to interfacial reactions. Emphasis was placed on studying the effect of anomalous behaviours of intermetallic compounds Cu6Sn5 during ageing processes.
Keywords :
ageing; copper alloys; crystal microstructure; melting; reliability; silver alloys; soldering; solders; solidification; tin alloys; SAC305; SnAgCu; VPS; accelerated isothermal aging; ageing; hot air solder levelling; melting; microstructure; printed circuit board; reliability; solder joint; solidification; vapour phase soldering; Aging; Copper; Electronics packaging; Gold; Isothermal processes; Mechanical factors; Microstructure; Soldering; Surface finishing; Temperature;
Conference_Titel :
Design and Technology of Electronics Packages, (SIITME) 2009 15th International Symposium for
Conference_Location :
Gyula
Print_ISBN :
978-1-4244-5132-6
Electronic_ISBN :
978-1-4244-5133-3
DOI :
10.1109/SIITME.2009.5407338
