Modeling and simulation of Pb-free solder joints behavior during laser soldering correlated to the 4P model

Laser soldering is a new and very promising soldering technology. The theory that stands at the base of this process was not fully developed, and the real conditions for soldering are far from ideal. Because of the many variables that appear in the calculus, modeling of the process is hard and many times it would be correct for ideal conditions, but would not apply in real life. We had to take into consideration all the elements for soldering (pad, paste, pin - the 3P model), and also the process involved, thus resulting the 4P model.