DocumentCode
3400364
Title
Evaluation of the characteristic impedance of microstrip interconnect lines on printed-circuit-boards
Author
Zolog, Monica ; Pitica, Dan ; Man, Lucian
Author_Institution
Appl. Electron. Dept., Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania
fYear
2009
fDate
17-20 Sept. 2009
Firstpage
167
Lastpage
172
Abstract
Available numerical methods for the characterization of microstrip lines involve extensive computations. The question that rises is which method should be used for a particular case. We propose to evaluate the results given by these formulas. The geometrical parameters of the microstrip structure are chosen in the commonly used range for PCBs. The purpose is to find out if well worth the effort to significantly increase the computational complexity to determine the characteristic impedance. For this, we have applied all the formulas for the same set of parameters, and we have analyzed the results by comparing them with the ones given by finite-difference time-domain (FDTD) simulation.
Keywords
computational complexity; electric impedance measurement; finite difference time-domain analysis; integrated circuit interconnections; microstrip lines; printed circuits; characteristic impedance; computational complexity; finite-difference time-domain simulation; microstrip interconnect lines; numerical methods; printed-circuit-boards; Dielectric constant; Dielectric materials; Dielectric substrates; Electronics packaging; Finite difference methods; Impedance; Integrated circuit interconnections; Microstrip; Strips; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology of Electronics Packages, (SIITME) 2009 15th International Symposium for
Conference_Location
Gyula
Print_ISBN
978-1-4244-5132-6
Electronic_ISBN
978-1-4244-5133-3
Type
conf
DOI
10.1109/SIITME.2009.5407380
Filename
5407380
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