• DocumentCode
    3400364
  • Title

    Evaluation of the characteristic impedance of microstrip interconnect lines on printed-circuit-boards

  • Author

    Zolog, Monica ; Pitica, Dan ; Man, Lucian

  • Author_Institution
    Appl. Electron. Dept., Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania
  • fYear
    2009
  • fDate
    17-20 Sept. 2009
  • Firstpage
    167
  • Lastpage
    172
  • Abstract
    Available numerical methods for the characterization of microstrip lines involve extensive computations. The question that rises is which method should be used for a particular case. We propose to evaluate the results given by these formulas. The geometrical parameters of the microstrip structure are chosen in the commonly used range for PCBs. The purpose is to find out if well worth the effort to significantly increase the computational complexity to determine the characteristic impedance. For this, we have applied all the formulas for the same set of parameters, and we have analyzed the results by comparing them with the ones given by finite-difference time-domain (FDTD) simulation.
  • Keywords
    computational complexity; electric impedance measurement; finite difference time-domain analysis; integrated circuit interconnections; microstrip lines; printed circuits; characteristic impedance; computational complexity; finite-difference time-domain simulation; microstrip interconnect lines; numerical methods; printed-circuit-boards; Dielectric constant; Dielectric materials; Dielectric substrates; Electronics packaging; Finite difference methods; Impedance; Integrated circuit interconnections; Microstrip; Strips; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology of Electronics Packages, (SIITME) 2009 15th International Symposium for
  • Conference_Location
    Gyula
  • Print_ISBN
    978-1-4244-5132-6
  • Electronic_ISBN
    978-1-4244-5133-3
  • Type

    conf

  • DOI
    10.1109/SIITME.2009.5407380
  • Filename
    5407380