• DocumentCode
    3400598
  • Title

    Preparation of micro-stacked insulators and experimental study

  • Author

    Ren, Chengyan ; Yuan, Weiqun ; Zhang, Dongdong ; Wang, Jue ; Yan, Ping

  • Author_Institution
    Inst. of Electr. Eng., Chinese Acad. of Sci., Beijing, China
  • fYear
    2009
  • fDate
    19-23 July 2009
  • Firstpage
    134
  • Lastpage
    137
  • Abstract
    High gradient insulating technology is one of the key technologies in new type dielectric wall accelerator. Micro-stacked insulators were prepared and preliminary experiment was done in this paper. Using high temperature laminated method, two types of micro-stacked insulators were designed and fabricated. The first was fabricated from interleaved layers of brass and polyimide (PI), and the other was fabricated from stainless steel and fluorinated ethylene propylene (FEP). Surface state of insulators was observed and out-gassing characteristics in vacuum were also detected. Based on the nanosecond (10 ns/30 ns) pulsed experimental platform, the vacuum surface flashover characteristics of micro-stacked samples were tested. Micro-stacked insulators exhibited favorable vacuum surface flashover performance and the maximum flashover field strength was close to 180 kV/cm.
  • Keywords
    dielectric devices; flashover; insulators; laminates; dielectric wall accelerator; flashover field strength; lamination; microstacked insulators; surface state; Dielectric materials; Dielectrics and electrical insulation; Electrons; Flashover; Linear accelerators; Materials science and technology; Polyimides; Steel; Temperature; Testing; micro-stacked insulator; nanosecond pulse; surface state; vacuum surface flashover;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4244-4367-3
  • Electronic_ISBN
    978-1-4244-4368-0
  • Type

    conf

  • DOI
    10.1109/ICPADM.2009.5252487
  • Filename
    5252487